Wooden Plaque from 1964 New York World’s Fair IBM Pavilion

A credit panel from the IBM Pavilion at the 1964 New York World’s Fair, salvaged by IBM employee John Berkenfield as the pavilion was being dismantled. Retrieved from the demolition debris and saved from disposal, the panel hung in Berkenfield’s home for many years. It remains a tangible remnant of the Eames Office’s collaboration with IBM.

Gift of John Berkenfield. Part of a group gift including Artifacts# G.2024.61.1, G.2024.61.3, and G.2024.61.4